 一、PCBA overview The board is based on the 6U VPX standard structure and includes an XCVU13P high-performance FPGA, an XC7Z020 management interface FPGA, dual-channel HPC FMC to expand high-speed AD, DA, optical fiber interfaces, etc. It is an ideal board for high-performance digital computing and optical fiber acceleration.  二、PCBA technical indicators ● The main FPGA processor uses Xilinx VirtexUltralSCALE+ series chip XCVU13P; ● Main FPGA plug-in 2 sets of DDR4, each set is 2GB, 64bit capacity; ● The main FPGA has 2 sets of external FMC HPC connectors, supporting LA, HA, HB, and 8 GTY interfaces; ● The main FPGA leads to 1 QSPF28, and the data rate supports 25GbpsX4; ● The main FPGA and VPX backplane are interconnected with 32 GTYs and 32 pairs of LVDS; ● 16 pairs of LVDS are interconnected between the master FPGA and the slave FPGAXC7Z020; ● Connect 32 pairs of LVDS or 64 LVTTL level IOs from the FPGA to the VPX backplane; ● Connect 1 channel Gigabit Ethernet, 4 channels RS232, and 2 channels Can from FPGA to VPX backplane; ● Externally plug DDR, QFlash, EMMC, and SD card from the PS side of the FPGA board; ● 1 Gigabit Ethernet, 2 RS232, and 1 HDMI interfaces are output from the FPGA front panel; ● The JTAG debugging ports of the two FPGAs are led out through the J30J connector; ● Hardware connection loads BPI mode from FPGA to main FPGA. 三、software ● Provide interface test programs for the main FPGA, including DDR4, optical fiber, RapidIO, FMC and other interfaces; ● Provide bare-running interface test programs from FPGA, including DDR3, RS232, and Gigabit network interfaces. (Linux operating system can be supported, but technical support is not provided) 四、Physical properties: Size: 6U VPX board, size 160X233.35mm. Working temperature: 0℃～ +55℃, supports industrial grade -40℃～ +85℃ Working humidity: 10% ~ 80% 五、Power supply requirements: DC power supply. The power consumption of the entire board is 100W. Voltage: +12V 10A. Ripple: ≤10% 六、Application areas: Software radio system, baseband signal processing, wireless simulation platform, high-speed image acquisition and processing, etc. |
