Core device |
Image acquisition chip | The United States, color reproduction is good |
Image processing chip | Taiwan, high performance low power | |
WIFI communication modular | Taiwan / The United States | |
Power processing chip | The United States,high conversion efficiency,low power/ low interference | |
High speed memory | The United States | |
Core specification |
Image size | 720×480@NTSC,720×576@PAL |
Support terminal | Android/IOS | |
Image compression format | H.264/MJPEG | |
WIFI | 802.11bgn | |
Electrical characteristics |
Working voltage | 3.3V |
Working current | 450Ma@3.3V(full-speed operation) | |
GPIO voltage | 3.3V | |
TTL Serial voltage | 3.3V/5V(compatibility) | |
Wireless performance |
Wireless communication | IEEE802.11b/g/n |
Frequency range | 2.400˜2.4835GHz | |
WIFI Module startup time | About five seconds | |
Large signal range | ≦100m(Empty distance) | |
802.11b transmitted power | 11 Mbps: 18±1.5dBm | |
802.11g transmitted power | 54 Mbps: 15±1.5dBm | |
802.11/n transmitted power | 135 Mbps: 15±1.5dBm | |
802.11b receiving sensitivity | 11M:-84dBm@8%PER | |
802.11g receiving sensitivity | 54M:-73dBm@10%PER | |
802.11/n receiving sensitivity | 135M:-72dBm@10%PER | |
Channel | 1˜11(the United States,Canada),1˜12China,Europe),1˜14(Japan) | |
Other parameters |
Modular antenna | external antenna, I-PEX port |
Module size | 38*38 | |
Image resolution | 720×480/720×576 pixel image | |
Image delay | < 500ms | |
Storage temperature | -20-80℃ | |
Operating temperature | -10-55℃ | |
ESD withstand voltage | 4KV |