196- 3U PXIe main control board based on AMD V3C18I

Item No.: 196
The 3U PXIe master control board based on the AMD V3C18I is a PXIe-compliant high-performance embedded computing module with a modular design and rich interfaces to meet a variety of storage and peripheral connectivity needs.
Description
1. Product Overview
The 3U PXIe master control board based on the AMD V3C18I is a PXIe-compliant high-performance embedded computing module with a modular design and rich interfaces to meet a variety of storage and peripheral connectivity needs. Flexibly adapt to a variety of application scenarios. Designed for applications such as industrial automation, networking equipment, edge computing, and medical devices. It is powered by AMD's advanced processor technology (Ryzen™ Embedded Series) to provide powerful computing power, graphics processing power, and rich I/O interfaces. The following are the indicator parameters about this product:
2. The technical characteristics of the product
  index parameter
CPU resources processor V3C18IV3000 series
CPU TDP range 10-25W
Number of CPU cores/threads 8 / 16
CPU reference frequency GHz 1.9 GHz
CPU overclocking GHz 3.8 GHz
L2 CPU cache 4 MB
L3 CPU cache 16 MB
PCIe Gen4 lanes 13 PCIE 4.0 Lanes;4 PCIE 3.0 Lanes
On-board resources Flash 32MB SPI FLASH
Maximum DDR5 throughput (MT/s) 1 group 16Gbyte; 4800 M
SATA hard drives 2TB
NVME HDD PCIe3.0X4 Supports 2TB capacity
AI module Compatible with Lingxi KA200 computing card and Haolo-8AI acceleration module;
PXIe connection XP4 Power, 5 trigger pulses (bidirectional), one trigger control signal input
XP3 PCIex8
XP2 LVDSUART/SPI
XP1  
Front panel connection USB 1channel USB4.0x2;
10 Gigabit network 2x10 Gbps Ethernet;
Gigabit network 1 x 1000M Ethernet
Other interfaces 1 x RS232
Video output HDMIx1
  Operating temperature -20+60
 
3. System block diagram 

4. Mechanical size:
3U PXIe main control board, please refer to the mechanical dimensions for detailed dimensions.
5. Heat dissipation method:
The whole board is air-cooled and dissipated.
6. Environmental performance indicators
6. 1 Operating temperature
Operating temperature: -20~+60°C (industrial grade/standard configuration). When used at high temperatures, the board needs to be dissipated well.
6. 2 Storage temperature
The storage temperature is -20~+85°C, and the product will not cause damage to function and appearance after storage within this temperature range. If the storage temperature required by the user is higher than this index, the whole plate test is used for screening.
6. 3 Ambient humidity
Relative humidity of board operation: 5%-95%, no condensation.
7. Power supply and power consumption
The motherboard is powered by a standard PXIE chassis and works when the DC voltage varies in the +5%/-3% range.
Appendix:
AMD Ryzen™ Embedded V3000 Series Processors at a Glance
Model number TDP range Number of CPU cores/threads CPU base frequency
Ghz
CPU overclocking GHz@80C (high) * l2cpcache
V3C48 35-54W 8/16 3.3GHz
 
3.8GHz 4MB
V3C44 35-54W 4/8 3.5GHz
 
3.8GHz 2MB
V3C18I 10-25W 8/16 1.9GHz
 
3.8GHz 4MB
V3C16 10-25W 6/12 2.0GHz
 
3.8GHz 3MB
V3C14 10-25W 4/8 2.3GHz
 
3.8GHz 2MB
 
Model number L3cpcache Maximum DDR5 throughput (MT/s, up to) PCIe Gen4 channel Ethernet port Junction temperature
V3C48 16MB 4,800 20L 2×10Gb 0-105C
V3C44 8MB 4,800 20L 2×10Gb 0-105C
V3C18I 16MB 4,800 20L 2×10Gb -40-105C
V3C16 16MB 4,800 20L 2×10Gb 0-105C
V3C14 8MB 4,800 20L 2×10Gb 0-105C
 
 
More important benefits:
1. Support Linux OS, with upstream Ubuntu and Yocto drivers
2.Planned product availability is up to 10 years, providing customers with a roadmap for long lifecycle support